Ultrananocrystalline diamond contacts for electronic devices

ABSTRACT

A method of forming electrical contacts on a diamond substrate comprises producing a plasma ball using a microwave plasma source in the presence of a mixture of gases. The mixture of gases include a source of a p-type or an n-type dopant. The plasma ball is disposed at a first distance from the diamond substrate. The diamond substrate is maintained at a first temperature. The plasma ball is maintained at the first distance from the diamond substrate for a first time, and a UNCD film, which is doped with at least one of a p-type dopant and an n-type dopant, is disposed on the diamond substrate. The doped UNCD film is patterned to define UNCD electrical contacts on the diamond substrate.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

The present application is a divisional of U.S. patent application Ser.No. 14/790,995, filed on Jul. 2, 2015, which is incorporated herein byreference in its entirety and for all purposes.

The United States Government claims certain rights in this inventionpursuant to Contract Nos. DE-AC02-98CH10886 and DE-SC0012704 awarded bythe U.S. Department of Energy to Brookhaven Science Associates, LLC,Contract No. W-31-109-ENG-38 between the United States Government andthe University of Chicago and/or pursuant to DE-AC02-06CH11357 betweenthe United States Government and UChicago Argonne, LLC representingArgonne National Laboratory.

TECHNICAL FIELD

The present disclosure relates generally to the field of electronicdevices and X-ray monitoring devices.

BACKGROUND

The progress of solid state devices has allowed fabrication of micro andnano-scale electronic devices for a wide range of applications. Mostconventional electronic devices are fabricated in silicon, germanium orsome other semi-conductor material. Metallic electrical contacts aregenerally used to interface such micro and nano-scale electronic deviceswith macro electronics. The metallic contact pads are susceptible tocorrosion so noble metals such as platinum and gold are often used toform the electrical contacts which increase the cost of such electronicdevices.

X-ray monitors are a class of electronic devices that are used tomonitor position of X-ray beams, flux and timing of X-ray beams. SuchX-ray beams can be included in synchrotron radiation which is defined asan electromagnetic wave radiated in a direction tangent to an orbit ofan electron having been accelerated by an electron accelerator.Synchrotron radiation can include light wavelengths ranging from visiblelight to hard X-rays and can be used to perform spectroscopy anddiffraction experiments. To perform such experiments, the X-ray beammonitors are necessary to monitor and stabilize X-ray beams.

Conventional X-ray monitors are formed from semi-conductor materialssuch as silicon and germanium. Such devices generally include a p-njunction formed in the semiconductor material. When X-ray beams areinjected into the p-n junction, electron-hole pairs are generated whichproduce current. However, such semi-conductor devices have a smallerresponse speed due to small saturated velocity of carriers because ofthe electric properties of silicon or germanium. For example, siliconhas a resistivity of 10⁵ Ohm-cm and germanium has low resistivity.Furthermore, such detectors produce excessive dark current.

In contrast, diamond is particularly attractive for fabricating X-raymonitors to measure flux, position and timing of monochromatic and whiteX-ray beam. Diamond, because of its low Z (atomic number), has lowerabsorption for X-rays, extreme resistance to corrosion and radiationdamage, high thermal conductivity and the ability to operate at hightemperatures with low leakage. A voltage is applied to an intrinsicregion of such diamond based X-ray monitors which acts as an activeelement obviating the need for a p-n junction. This is because diamondhas sufficiently high resistivity in its intrinsic region. Therefore,electron-hole pairs are generated in the entire region of the diamondthrough which X-ray beams pass.

Conventional diamond based X-ray monitors, however include metalelectrical contacts. Since metals have high atomic number (Z), the metalelectrical contacts absorb a significantly higher amount of X-raysrelative to the diamond thereby, drastically reducing the efficiency ofsuch diamond detectors.

SUMMARY

Embodiments described herein relate generally to electronic devices thatinclude p-doped or n-doped ultrananocrystalline diamond (UNCD)electrical contacts and in particular to diamond X-ray monitors thatinclude the p-doped or n-doped UNCD electrical contacts.

In some embodiments, a method of forming electrical contacts on adiamond substrate comprises producing a plasma ball using a microwaveplasma source in the presence of a mixture of gases. The mixture ofgases includes a source of a p-type or an n-type dopant. The plasma ballis disposed at a first distance from the diamond substrate. The diamondsubstrate is maintained at a first temperature. The plasma ball ismaintained at the first distance from the diamond substrate for a firsttime, and a UNCD film, which is doped with at least one of a p-typedopant and an n-type dopant, is disposed on the diamond substrate. Thedoped UNCD film is patterned to define UNCD electrical contacts on thediamond substrate.

In other embodiments, a device comprises a diamond substrate whichincludes electronic circuitry disposed within the diamond substrate. Atleast one electrical contact is disposed on the diamond substrate. Theat least one electrical contact includes a p-doped or an n-doped UNCDwhich is in electrical communication with the electronic circuitry.

In still another embodiment, an X-ray monitor comprises a diamondsubstrate having a surface. A plurality of electrical contacts aredisposed on the surface. The plurality of electrical contacts include ap-doped or an n-doped UNCD and have an X-ray absorption of less thanabout 1%.

It should be appreciated that all combinations of the foregoing conceptsand additional concepts discussed in greater detail below (provided suchconcepts are not mutually inconsistent) are contemplated as being partof the inventive subject matter disclosed herein. In particular, allcombinations of claimed subject matter appearing at the end of thisdisclosure are contemplated as being part of the inventive subjectmatter disclosed herein.

BRIEF DESCRIPTION OF DRAWINGS

The foregoing and other features of the present disclosure will becomemore fully apparent from the following description and appended claims,taken in conjunction with the accompanying drawings. Understanding thatthese drawings depict only several implementations in accordance withthe disclosure and are therefore, not to be considered limiting of itsscope, the disclosure will be described with additional specificity anddetail through use of the accompanying drawings.

FIG. 1 is a schematic flow diagram of an exemplary method of formingp-doped or n-doped UNCD contacts on a diamond substrate according to anembodiment.

FIG. 2 is a schematic illustration of one embodiment of an electronicdevice that includes p-doped or n-doped UNCD electrical contacts.

FIG. 3 is a schematic illustration of another embodiment of an X-raymonitor that includes p-doped or n-doped UNCD electrical contacts whichhave an X-ray absorption of less than about 1%.

FIG. 4 is a schematic illustrations of an experimental setup for X-raybeam induced current mapping using a diamond detector that includes UNCDelectrical contacts.

FIG. 5 panel (A) is an X-ray topography image, panel (B) is an image ofa n-doped UNCD (N-UNCD) contact grown on diamond, and panel (C) is abirefringence image of the N-UNCD contact of panel (B).

FIG. 6 is a plot of responsivity of 0.3 mm thick diamond H1D10 coatedwith N-UNCD on both sides as contacts.

FIG. 7 panels (A-D) are 2D responsivity maps for diamond with N-UNCDgrown as contacts taken at: 350 eV and +50 V (panel (A)); 1,000 eV and−50 V (panel (B)); 19 keV and +50 V (panel (C)); and 19 keV and −50 V(panel (D)).

FIG. 8 is a plot of near edge X-ray absorption fine structure (NEXAFS)data taken at a beam line comparing the partial electron yield (PEY)between clean diamond and UNCD contacts.

Reference is made to the accompanying drawings throughout the followingdetailed description. In the drawings, similar symbols typicallyidentify similar components, unless context dictates otherwise. Theillustrative implementations described in the detailed description,drawings, and claims are not meant to be limiting. Other implementationsmay be utilized, and other changes may be made, without departing fromthe spirit or scope of the subject matter presented here. It will bereadily understood that the aspects of the present disclosure, asgenerally described herein, and illustrated in the figures, can bearranged, substituted, combined, and designed in a wide variety ofdifferent configurations, all of which are explicitly contemplated andmade part of this disclosure.

DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS

Embodiments described herein relate generally to electronic devices thatinclude p-doped or n-doped UNCD electrical contacts and in particular todiamond X-ray monitors that include the p-doped or n-doped UNCDelectrical contacts.

Embodiments of the electronic devices that include the p-doped orn-doped UNCD electrical contacts described herein provide severalbenefits including, for example: (1) replacing metal contacts withp-doped (e.g., boron doped) or n-doped (e.g., nitrogen doped) UNCDelectrical contacts; (2) having high chemical resistance, highelectrical conductivity, high thermal conductivity and resistance tooxidation or otherwise corrosion even at high temperatures of up toabout 800 degrees Celsius; (4) providing superior adhesion to diamondsubstrates used in X-ray monitors; (3) having a low atomic number whichenables the doped UNCD electrical contacts to have an X-ray absorptionof less than 1% thereby having minimal or no impact on the efficiency ofthe diamond X-ray monitor; and (5) having superior resistance to damagewhich can be caused by high flux X-rays relative to metal electricalcontacts.

As used herein, the term “ultrananocrystalline diamond (UNCD)” refers tocrystalline diamond that has a grain size in the range of 2 nm to 10 nm.

As used herein, the term “p-type dopant” refers to elements that can beincorporated into a semi-conductor such as silicon, germanium or UNCD tocreate a deficiency of valence electrons called “holes” in thesemi-conductor, thereby greatly increasing the conductivity of thesemi-conductor. Such p-type dopants can include, for example boron,aluminum or gallium or any other element that can create holes in thesemi-conductor.

As used herein, the term “n-type dopant” refers to elements that can beincorporated into a semi-conductor such as silicon, germanium or UNCD toprovide free electrons, thereby greatly increasing the conductivity ofthe semi-conductor. Such n-type dopants include phosphorous, antimony,arsenic, nitrogen or any other element that can contribute freeelectrons to the semi-conductor.

FIG. 1 is schematic flow diagram of an exemplary method 100 forfabricating a p-doped or an n-doped UNCD electrical contact on a diamondsubstrate. The diamond substrate can be included in an electronicdevice, for example an X-ray monitor for measuring flux, position and/ortiming of monochromatic and white X-ray beam due to its low absorption,extreme resistance to corrosion and radiation damage, high thermal andelectrical conductivity, and the ability to operate at high temperatureswith low leakage.

The method 100 includes producing a plasma ball using a microwave plasmasource in the presence of a mixture of gases which include a source of ap-type or an n-type dopant, at 102. The substrate can have any shape orsize, for example a sheet, a block, a wafer, etc.

In one embodiment, the substrate can be disposed or positioned in aninternal volume defined by a chamber (e.g., a microwave plasma chemicalvapor deposition (MPCVD) chamber). The chamber can be sealed and any airor otherwise gases contained within the chamber can be evacuated byapplying a vacuum to the chamber. The mixture of gases can be introducedinto the internal volume of the chamber. In some embodiments, themixture of gases can include argon, methane (e.g., about 0.1% to 1% byvolume) and hydrogen (e.g., about 5% to about 10% by volume). In otherembodiments, the mixture of gases can include methane and argon only. Instill other embodiments, the mixture of gases can include otherhydrocarbon sources such as acetylene in combination with other inertgases such as Neon, Helium, Xenon, etc.

As described herein, the mixture of gases also include a source of ap-type dopant or an n-type dopant. In one embodiment, the mixture ofgases can include a source of boron such as a boron gas (e.g., B₂H₆ ortrimethyl borate, or solid boron source such as boron powder) as thep-type dopant. In other embodiments, the mixture of gases can include asource of nitrogen as the n-type dopant. Nitrogen gas can be used as thesource of nitrogen in the range of about 5% by volume to about 20% byvolume. Furthermore, the p-type doping and n-type doping can also beachieved using other means such as ion-implantation.

The chamber can be maintained at a first pressure. In some embodiments,the first pressure can be in the range of about 40 Torr to about 70 Torr(e.g., about 40 Torr, 45 Torr, 50 Torr, 55 Torr, 60 Torr, 65 Torr orabout 70 Torr inclusive of all ranges and values therebetween).

In some embodiments, a 915 MHz microwave plasma source can be used toproduce the plasma ball. In other embodiments, any other microwaveplasma source can be used, for example a 2.45 MHz microwave plasmasource. In such embodiments, the plasma ball can have a diameter in therange of about 15 cms to about 30 cms, for example, about 16 cms, 18cms, 20 cm, 22 cms, 24 cms, 26 cms, 28 cms or about 29 cms inclusive ofall ranges and values therebetween. In some embodiments, the diameter ofthe plasma ball can be about 25 cms. Furthermore, any suitable power canbe used to produce the plasma source, for example a power in the rangeof about 2 kW to about 3 kW (e.g., 2 kW, 2.2 kW, 2.4 kW, 2.6 kW, 2.8 kWor about 3 kW inclusive of all ranges and values therebetween).

The plasma ball is maintained at a first distance from the diamondsubstrate and maintained at a first temperature, at 104. For example,the diamond substrate can be disposed or positioned on a first microwaveelectrode maintained at the first temperature. In some embodiments, thefirst temperature can be in the range of about 200 degrees Celsius toabout 450 degrees Celsius (e.g., about 220 degrees Celsius, 240 degreesCelsius, 260 degrees Celsius, 280 degrees Celsius, 300 degrees Celsius,320 degrees Celsius, 340 degrees Celsius, 360 degrees Celsius, 380degrees Celsius, 400 degrees Celsius, 420 degrees Celsius, or about 440degrees Celsius, inclusive of all ranges and values therebetween). Inother embodiments, the first temperature can be in the range of about350 to about 900 degrees Celsius (e.g., 350 degrees Celsius, 400 degreesCelsius, 450 degrees Celsius, 500 degrees Celsius, 550 degrees Celsius,600 degrees Celsius, 650 degrees Celsius, 700 degrees Celsius, 750degrees Celsius, 800 degrees Celsius, 850 degrees Celsius or 900 degreesCelsius inclusive of all ranges and values therebetween). In particularembodiments, the first distance can be about 0.5 mm to about 5 mm (e.g.,about 1 mm, 2 mm, 3 mm, or about 4 mm) inclusive of all ranges andvalues therebetween.

The plasma ball is maintained at the first distance from the diamond fora first time, at 106. In some embodiments, the first time can be about20 minutes to about 60 minutes (e.g., about 25 minutes, 30 minutes, 35minutes, 40 minutes, 45 minutes, 50 minutes, or about 55 minutesinclusive of all ranges and values therebetween).

A UNCD film is disposed (e.g., deposited, coated or grown) over thediamond substrate and is doped with at least one of a p-type or an typedopant, at 108. For example, the UNCD film can be a boron doped UNCD(B-UNCD) film having a concentration of the boron in the B-UNCD film canbe in the range of about 1×10²¹ atoms per cm³ to about 9×10²¹ atoms percm³ (e.g., about 2×10²¹, 3×10²¹, 4×10²¹, 5×10²¹, 6×10²¹, 7×10²¹, orabout 8×10²¹ atoms per cm³ inclusive of all ranges and valuestherebetween). In one embodiment, the boron concentration in the B-UNCDfilms can be about 4.8×10²¹ atoms per cm³.

In other embodiments, the UNCD film can be a nitrogen doped UNCD(N-UNCD) film having a percentage of nitrogen in the N-UNCD film ofabout 0.05 atom % to about 0.5 atom % (e.g., about 0.05 atom %, 0.06atom %, 0.07 atom %, 0.08 atom %, 0.09 atom %, 0.1 atom %, 0.2 atom %,0.3 atom %, 0.4 atom % or about 0.5 atom % inclusive of all ranges andvalues therebetween).

While described as being disposed or deposited using a microwave plasmasource, any other method can be used to dispose or deposit the dopedUNCD film over the diamond substrate. In one embodiment, the UNCD filmis disposed or deposited over the sacrificial layer using hot filamentchemical vapor deposition (HFCVD).

In particular embodiments, the thickness of the doped UNCD film can bein the range of about 20 nm to about 200 nm (e.g., 20 nm, 40 nm, 60 nm,80 nm, 100 nm, 120 nm, 140 nm, 160 nm, 180 nm or about 200 nm inclusiveof all ranges and values therebetween).

In some embodiments, a masking layer is optionally disposed (e.g.,deposited, coated or formed) on the doped UNCD film, at 110. In suchembodiments, the masking layer is patterned to define a pattern ofelectrical contacts in the masking layer, at 112. In some embodiments,masking layer can include an optical photolithography photoresist or anelectron beam photoresist (e.g., hydrogen silsesquioxane (HSQ)). Inother embodiments, the masking layer can include a metallic layer, forexample, a titanium and platinum layer.

In still other embodiments, multiple masking layers can be used. Forexample, a first masking layer which includes a metal can be disposed(e.g., deposited, coated or formed) on the diamond substrate. A secondmasking layer, for example the optical or electron beam photoresist canbe disposed (e.g., deposited, coated or formed) on the first maskinglayer. The second masking layer can be patterned using opticallithography or electron beam lithography to define a pattern of theelectrical contacts in the second masking layer. The second maskinglayer is then used as a masking layer for the first masking layer. Thefirst masking layer can, for example be etched using etchants (e.g.,acids) to transfer the pattern in the first masking layer. The secondmasking layer is removed such that the first masking layer can serve asan etch mask for the doped UNCD film. In one embodiment, the first andsecond masking layer can together be used as an etch mask for the dopedUNCD film.

The doped UNCD film is patterned to define UNCD electrical contacts onthe diamond substrate, at 114. In some embodiments, the masking layer(e.g., the first and/or second masking layer) can be used as an etchmask for patterning the doped UNCD film to define electrical contacts inthe doped UNCD film. The doped UNCD film can be etched using anysuitable process such as, for example, oxygen plasma etching, usingreactive ion etch process or any other suitable etching process.

The masking layer is removed to leave the diamond substrate with UNCDelectrical contacts disposed thereon. In some embodiments, the UNCD filmcan be patterned to define the electrical contacts without using amasking layer, for example via laser etching.

In this manner B-UNCD or N-UNCD electrical contacts can be formed on adiamond substrate. The doped UNCD electrical contacts have low X-rayabsorption, high thermal and electrical conductivity, good adhesion todiamond and excellent thermal properties. In some embodiments, the dopedUNCD electrical contacts can have an X-ray absorption of less than about1%. Thus the doped UNCD electrical contacts are particularly beneficialas electrical contacts for X-ray monitors.

The doped UNCD electrical contacts can have high thermal stability. Insome embodiments, the UNCD electrical contacts do not oxidize orotherwise corrode up to a temperature of about 800 degrees Celsius invacuum. Furthermore, the doped UNCD electrical contacts are resistant toozone exposure and are resistant to acids. The doped UNCD electricalcontacts have sufficient electrical conductivity to allow ampere levelcurrents to pass through while limiting charge injection and persistentcurrent. The UNCD electrical contacts provide devices with linear fluxresponse over a broad range of X-ray wavelengths, for example in therange of 100 eV to 30 keV inclusive of all ranges and valuestherebetween.

FIG. 2 shows a schematic illustration of a device 200 that includes adiamond substrate 210 and at least one p-doped or n-doped UNCDelectrical contact 220. The device 200 can include any electronic devicesuch as, for example p-n junction devices (e.g., solar cells,photocells, diodes, tunnel diodes, zener diodes, LEDs), PIN diodes,transistors, metal oxide semi-conductor field effect transistors(MOSFET), sensors (e.g., Hall effect sensors), integrated circuits,charge coupled devices (CCDs), ROMs, RAMs, etc.

The diamond substrate 210 includes electronic circuitry 212 disposedwithin the diamond substrate 210. For example, the diamond substrate 210can be implanted with a p-type dopant (e.g., boron) and/or an n-typedopant (e.g., phosphorous) to form electronic circuits (e.g., a p-njunction) within the diamond substrate 210. The diamond substrate 210based electronic device can have similar or superior electronicproperties to conventional semi-conductor materials (e.g., silicon orgermanium) but has higher durability, is resistant to high temperatureand chemicals, and provides excellent thermal conductivity.

The device 200 includes at least one p-doped or n-doped UNCD electricalcontact 220 disposed or deposited on the diamond substrate 210. Thedoped UNCD electrical contact 220 is in electrical communication withthe electronic circuitry 212 and is configured to provide electricalinterface of the electronic circuitry 212 with electronicinstrumentation.

In some embodiments, the UNCD electrical contacts 220 can be doped witha p-type dopant. For example, the UNCD electrical contacts 220 can bedoped with boron (i.e., B-UNCD) and have a concentration of the boron inthe B-UNCD electrical contacts 220 can be in the range of about 1×10²¹atoms per cm³ to about 9×10²¹ atoms per cm³ (e.g., about 2×10²¹, 3×10²¹,4×10²¹, 5×10²¹, 6×10²¹, 7×10²¹, or about 8×10²¹ atoms per cm³ inclusiveof all ranges and values therebetween). In one embodiment, the boronconcentration in the B-UNCD electrical contacts 220 can be about4.8×10²¹ atoms per cm³.

In other embodiments, the UNCD electrical contacts 220 can be doped withan n-type dopant. For example, the UNCD electrical contacts 220 can bedoped with nitrogen such that the electrical contacts 220 includeN-UNCD. In such embodiments, N-UNCD electrical contacts 220 can have aconcentration of nitrogen in the electrical contacts in the range ofabout 0.05 atom % to about 0.5 atom % (e.g., about 0.05 atom %, 0.06atom %, 0.07 atom %, 0.08 atom %, 0.09 atom %, 0.1 atom %, 0.2 atom %,0.3 atom %, 0.4 atom % or about 0.5 atom % inclusive of all ranges andvalues therebetween).

The doped UNCD electrical contacts 220 can be formed using any suitablemethod, for example the method 200 or any other method described herein.The doped UNCD electrical contacts 220 can have high thermal stability.In some embodiments, the doped UNCD electrical contacts 220 do notoxidize or otherwise corrode up to a temperature of about 800 degreesCelsius in vacuum. Furthermore, the doped UNCD electrical contacts 220are resistant to ozone exposure and are resistant to acids. The dopedUNCD electrical contacts 220 have sufficient electrical conductivity toallow ampere level currents to pass through while limiting chargeinjection and persistent current.

FIG. 3 is a schematic illustration of an X-ray monitor 300 that includesa diamond substrate 310 and p-doped or n-doped UNCD electrical contacts320, according to an embodiment. The X-ray monitor 300 can be used as aflux, position and/or timing monitor for monochromatic and white X-raybeam due to its low absorption, extreme resistance to corrosion andradiation damage, high thermal conductivity and the ability to operateat high temperatures with low leakage.

The diamond substrate 310 can be in the form of a sheet or a plate. Thediamond substrate 310 is disposed or positioned in line with andperpendicular to a X-ray beam which can be produced, for example by asynchrotron. The diamond substrate 310 includes a first surface 311 anda second surface 313 opposing the first surface 311. The diamondsubstrate 310 is disposed or positioned such that the X-rays impingeperpendicularly on the second surface 313. The X-rays generateelectron-hole pairs in the entire region of the diamond substrate 310through which they pass generating photoelectrons.

The plurality of p-doped or n-doped UNCD electrical contacts 320 aredisposed or deposited on the first surface 311 of the X-ray monitor 300.The doped UNCD electrical contacts 320 are in electrical communicationwith the diamond substrate 310 and are configured to provide electricalinterface of the diamond substrate 310 with electronic instrumentation330. The plurality of doped UNCD electrical contacts 320 can have athickness in the range of about 50 nm to about 200 nm.

In some embodiments, the UNCD electrical contacts 220 can be doped witha p-type dopant. For example, the UNCD electrical contacts 220 can bedoped with boron (i.e., B-UNCD). A concentration of the boron in theB-UNCD electrical contacts 320 can be in the range of about 1×10²¹ atomsper cm³ to about 9×10²¹ atoms per cm³ (e.g., about 2×10²¹, 3×10²¹,4×10²¹, 5×10²¹, 6×10²¹, 7×10²¹, or about 8×10²¹ atoms per cm³ inclusiveof all ranges and values therebetween). In one embodiment, the boronconcentration in the B-UNCD electrical contacts 320 can be about4.8×10²¹ atoms per cm³.

In other embodiments, the UNCD electrical contacts 320 can be doped withan n-type dopant. For example, the UNCD electrical contacts 320 can bedoped with nitrogen such that the electrical contacts 320 includeN-UNCD. In such embodiments, N-UNCD electrical contacts 320 can have aconcentration of nitrogen in the electrical contacts in the range ofabout 0.05 atom % to about 0.5 atom % (e.g., about 0.05 atom %, 0.06atom %, 0.07 atom %, 0.08 atom %, 0.09 atom %, 0.1 atom %, 0.2 atom %,0.3 atom %, 0.4 atom % or about 0.5 atom % inclusive of all ranges andvalues therebetween).

The doped UNCD electrical contacts 320 have an X-ray absorption of lessthan about 1%. The doped UNCD electrical contacts 320 have high thermaland electrical conductivity, good adhesion to diamond and excellentthermal properties. While FIG. 13 shows the doped UNCD electricalcontacts 320 as being disposed only the first surface 311, in someembodiments a plurality of doped UNCD electrical contacts 320 can alsobe disposed on the second surface 313 of the diamond substrate 320.

The doped UNCD electrical contacts 320 can be formed using any suitablemethod, for example the method 200 or any other method described herein.The doped UNCD electrical contacts 320 can have high thermal stability.In some embodiments, the doped UNCD electrical contacts 320 do notoxidize or otherwise corrode up to a temperature of about 800 degreesCelsius in vacuum. Furthermore, the doped UNCD electrical contacts 320are resistant to ozone exposure and are resistant to acids. The dopedUNCD electrical contacts 320 have sufficient electrical conductivity toallow ampere level currents to pass through while limiting chargeinjection and persistent current. The doped UNCD electrical contacts 320provide devices with linear flux response over a broad range of X-raywavelengths, for example in the range of 100 eV to 30 keV inclusive ofall ranges and values therebetween.

As described herein, when the X-ray beam irradiates the diamondsubstrate 310, electron-hole pairs are generated in the diamondsubstrate 310. The electronic instrument 330 can be used to exert apositive potential on the doped UNCD electrical contacts 340. Theelectrons generated in the diamond substrate 310 are communicated viathe doped UNCD electrical contacts 320 to the electronic instrumentation330. The amount of current communicated or any other electronicparameter can be used by the electronic instrumentation to determine aflux and/or position of the X-ray beam by the X-ray monitor.

The following section describes examples of X-ray detectors thatincludes UNCD contacts. These examples are only for illustrativepurposes and are not meant to limit the scope of the concepts describedherein.

EXPERIMENTAL EXAMPLES

FIG. 4 shows a schematic illustration of an experimental setup for X-raybeam induced current mapping using a diamond detector that includesN-UNCD electrical contacts. Copper (Cu) mount electrodes areelectrically coupled to the N-UNCD contacts to allow interface withdetector electronics. The Cu mount electrodes are however disposed on anarea of the N-UNCD electrical contacts which is sufficiently distal to aportion of the N-UNCD electrical contacts which is in line with theX-ray beam. The Cu mount electrodes therefore, do not interfere with theX-ray beam detection. The detector is raster scanned through the X-raymicrobeam. Pulse bias is provided at low photon energy to reducetrapping effects. The setup is used to measure both the X-rayresponsivity and uniformity mapping.

FIG. 5 panel (A) is an X-ray topography image of N-UNCD electricalcontact deposited on the diamond substrate which shows an excellentcrystalline quality of the N-UNCD electrical contacts. FIG. 5 panel (B)is an optical image of an N-UNCD electrical contact grown on a diamondsubstrate. FIG. 5 panel (C) is a birefringence image of the N-UNCDcoated diamond of FIG. 5 panel (B). The birefringence is clean in theactive area of the device which typically results in a device free ofhotspots. This is advantageous in a UNCD coated device, as the contactswill not prevent photoconductive gain in the diamond substrate.

FIG. 6 is a plot of responsivity of a 0.3 mm thick diamond (HID10)coated with N-UNCD diamond on both sides as electrical contacts. Theplot shows measured responsivity of electrons and holes as carriers.These responsivity curves are compared to the calculated curves of amodel Pt coated X-ray detector (labelled “Theory”). The responsivity ofthe diamond with N-UNCD contacts matches well with the “Reference” plotdemonstrating that the diamond detector with N-UNCD contacts is suitableas a calibrated X-ray detector.

FIG. 7 panels (A-D) are 2D responsivity maps for diamond with N-UNCDgrown as contacts taken at: 350 eV and +50 V (panel (A)); 1,000 eV and−50 V (panel (B)); 19 keV and +50 V (panel (C)); and 19 keV and −50 V(panel (D)). The low energy response (panel (A)) shows the effects ofthe thickness of the UNCD contact with a lower response in the centerwhere the coating is the thickest. Once the photon energy increases suchthat most of the x-rays are transmitted through the UNCD contact, theactive area shows good response uniformity (panels (B-D)).

FIG. 8 is a plot of NEXAFS data taken at an X-ray beamline (Beamline U7Aat the national synchrotron light source, Brookhaven NationalLaboratory) comparing the PEY between clean diamond and the UNCDcontacts. The detector current from a diamond X-ray detector with UNCDcontacts, converted to a NEXAFS spectrum, is also shown for comparison.These data confirm that the contact is predominately diamond (as opposedto non-diamond carbon) and that the detector has the expected responseacross the carbon edge.

As used herein, the terms “about” generally means plus or minus 10% ofthe stated value. For example, about 0.5 would include 0.45 and 0.55,about 10 would include 9 to 11, about 1000 would include 900 to 1100.

It should be noted that the term “exemplary” as used herein to describevarious embodiments is intended to indicate that such embodiments arepossible examples, representations, and/or illustrations of possibleembodiments (and such term is not intended to connote that suchembodiments are necessarily extraordinary or superlative examples).

The terms “coupled,” and the like as used herein mean the joining of twomembers directly or indirectly to one another. Such joining may bestationary (e.g., permanent) or moveable (e.g., removable orreleasable). Such joining may be achieved with the two members or thetwo members and any additional intermediate members being integrallyformed as a single unitary body with one another or with the two membersor the two members and any additional intermediate members beingattached to one another.

It is important to note that the construction and arrangement of thevarious exemplary embodiments are illustrative only. Although only a fewembodiments have been described in detail in this disclosure, thoseskilled in the art who review this disclosure will readily appreciatethat many modifications are possible (e.g., variations in sizes,dimensions, structures, shapes and proportions of the various elements,values of parameters, mounting arrangements, use of materials, colors,orientations, etc.) without materially departing from the novelteachings and advantages of the subject matter described herein. Othersubstitutions, modifications, changes and omissions may also be made inthe design, operating conditions and arrangement of the variousexemplary embodiments without departing from the scope of the presentinvention.

What is claimed is:
 1. A device, comprising: a diamond substrateincluding electronic circuitry disposed within the diamond substrate; atleast one electrical contact disposed on the diamond substrate, the atleast one electrical contact including a p-doped or an n-dopedultrananocrystalline diamond, the electrical contacts in electricalcommunication with the electronic circuitry.
 2. The device of claim 1,wherein the p-type dopant includes boron.
 3. The device of claim 2,wherein the p-type dopant includes a boron concentration in the range ofabout 1×1021 atoms per cm3 to about 9×1021 atoms per cm3.
 4. The deviceof claim 1, wherein the n-type dopant includes nitrogen.
 5. The deviceof claim 3, wherein the ultrananocrystalline diamond film has apercentage of nitrogen in the range of about 0.05 atom % to about 0.5atom %.
 6. The device of claim 1, wherein the device includes at leastone of a solar cell, photocell, diode, light emitting diode, a sensor, adetector, a transistor, a field effect transistor, an integratedcircuit, a read only memory and a random access memory.
 7. The device ofclaim 1, wherein the at least one electrical contact has a thickness inthe range of about 50 nm to about 200 nm.
 8. An X-ray monitor,comprising: a diamond substrate having a surface; and a plurality ofelectrical contacts disposed on the surface, the plurality of electricalcontacts including at least one of a p-doped and a n-dopedultrananocrystalline diamond, wherein the electrical contacts have anX-ray absorption of less than about 1%.
 9. The X-ray monitor of claim 8,wherein the p-type dopant includes boron.
 10. The X-ray monitor of claim9, wherein the p-type dopant includes a boron concentration in the rangeof about 1×1021 atoms per cm3 to about 9×1021 atoms per cm3.
 11. TheX-ray monitor of claim 8, wherein the n-type dopant includes nitrogen.12. The X-ray monitor of claim 11, wherein the ultrananocrystallinediamond film has a percentage of nitrogen in the range of about 0.05atom % to about 0.5 atom %.
 13. The X-ray monitor of claim 8; whereinthe surface is a first surface, the diamond substrate furthercomprising: a second surface disposed opposite the first surface; and aplurality of second surface ultrananocrystalline diamond electricalcontacts, selected from the group consisting of p-dopedultrananocrystalline diamond electrical contacts and n-dopedultrananocrystalline diamond electrical contacts, disposed on the secondsurface.
 14. The X-ray monitor of claim 13, wherein the plurality ofelectrical contacts and the plurality of second surface electricalcontacts do not oxidize up to a temperature of about 800 degrees Celsiusin vacuum.
 15. The X-ray monitor of claim 13, wherein the X-ray monitorhas a linear flux response to X-rays having energy in the range of 100eV to 30 keV.
 16. The X-ray monitor of claim 8, further wherein theplurality of ultrananocrystalline diamond electrical contracts have anX-ray absorption of less than about 1%.